FP7-PICS Project Publications





Publication Overview

Title of Publication Author(s) Link
Picosun ALD enables a new generation of medical devices Picosun click here 
Innovative ALD materials and tools or high densIty 3D integrated capacitors Fraunhofer IPMS click here
Presentation: NIL industrial Days (19-20 March 2015, Berlin) Pinnow (SENTECH) click here
Presentation: EuroNanoForum (10-15 June 2015, Riga) C. Billard (CEA) click here
Presentation: "Development of innovative ALD materials for high density 3D integrated capacitors” ALD Symposium, SEMICON Europe 2014 (7-9 October 2015, Grenoble) M. Czernohorsky (Fraunhofer IPMS-CNT) click here
Presentation: "Ultra-thin high density capacitors for advanced packaging solutions" 20th European Microelectronics and Packaging Conference & Exhibition (September 13-16, 2015 in Friedrichshafen, Germany) K. Seidel (Fraunhofer IPMS-CNT) click here
Presentation: "HfO2-Al2O3 nanolaminate dielectric for ultra-high integrated MIM capacitors" RAFALD workshop (November 16-18, 2015 Grenoble, France). A. Lefevre click here 
PICS Poster   click here